AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters

Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 ...
Semiconductor Engineering

Co-Packaged Optics Reaches Power Efficiency Tipping Point

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...
Semiconductor Engineering

Transforming Test For Co-packaged Optics

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the ...
AZoNano

100X Faster Optical Alignment--Automation Stages, Firmware and Software and Algorithms Help Speed up the Production of Photonic Devices

Intelligent algorithms, faster motion controllers and the latest multi-axis mechanical motion systems allow to reduce the alignment time of photonics components and silicon photonics chips by 99% or ...