These new AI-focused SBCs pair multicore processors with integrated NPUs for edge computing, robotics, and embedded ...
Abstract: This paper presents a board-level integrated silicon carbide (SiC) mosfet power module for high temperature and high power density application. Specifically, a silicon-on-insulator ...
Abstract: Low-profile double-side cooled power modules are emerging in electric-drive inverters to achieve higher power density and efficiency. However, the rigid interconnection between the devices ...
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