The release includes an embedded MCP server that exposes Spring project analytics to AI coding assistants, along with first-class support for Spring AI and automated property refactoring.
ππΌπΌπ΄πΉπ² ππΌπΌπΈπ ππ»ππ²πΉ ππΌπΏ π―π + π§π£π¨π TSMC is full. Google needs a new way to package chips. Google booked Intel to package 3 million TPUs in 2028. TSMC CoWoS lines are sold out ...
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