EE World Online

Chiplets past, present, and future: how advanced packaging is shaping silicon

Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...

Meituan open sources LongCat-2.0, the 1.6T, near-frontier agentic coding model that's been leading OpenRouter — trained entirely on Chinese chips

By registering the LongCat-2.0 repository under the open-source MIT License, Meituan positions the architecture with maximum ...
The Next Platform

Optical Scale Up Fabrics Are Limited By Manufacturing, Not Architecture

Earlier this spring, AMD, Broadcom, Meta Platforms, Microsoft, Nvidia, and OpenAI formed the Optical Compute Interconnect ...
Silicon Semiconductor

A new era for EUV lithography: How Multi-Trigger Resist technology could redefine semiconductor scaling

Dinesh Bettadapur, Irresistible Materials’ CEO, discusses the company’s strategic partnership with TOK, the evolution of ...